Comparison of thermomigration behaviors between Pb-free flip chip solder joints and microbumps in three dimensional integrated circuits: Bump height effect-Reference-Cited by-同舟云学术

Comparison of thermomigration behaviors between Pb-free flip chip solder joints and microbumps in three dimensional integrated circuits: Bump height effect

Published:2013-01-28 Issue:4 Volume:113 Page:043711
ISSN:0021-8979
Container-title:Journal of Applied Physics
language:en
Short-container-title:Journal of Applied Physics

Author:

Ouyang Fan-Yi,Jhu Wei-Cheng

Funder

National Science Council Taiwan

Publisher

AIP Publishing

Subject

General Physics and Astronomy

Link

http://aip.scitation.org/doi/pdf/10.1063/1.4789025

Reference22 articles.

1. Calibration of electromigration reliability of flip-chip packages by electrothermal coupling analysis

2. Thermomigration in Pb–Sn solder joints under joule heating during electric current stressing

3. Thermomigration in SnPb composite flip chip solder joints

4. Microstructural evolution and atomic transport by thermomigration in eutectic tin-lead flip chip solder joints

5. Effect of entropy production on microstructure change in eutectic SnPb flip chip solder joints by thermomigration

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