Formation of a buried oxide film at the damage peak induced by oxygen implantation into a Si substrate
Author:
Publisher
AIP Publishing
Subject
Physics and Astronomy (miscellaneous)
Link
http://aip.scitation.org/doi/pdf/10.1063/1.123796
Reference9 articles.
1. C.M.O.S. devices fabricated on buried SiO2 layers formed by oxygen implantation into silicon
2. Analysis of thin‐film silicon‐on‐insulator structures formed by low‐energy oxygen ion implantation
3. Practical reduction of dislocation density in SIMOX wafers
4. Analysis of buried oxide layer formation and mechanism of threading dislocation generation in the substoichiometric oxygen dose region
5. Extension of Dose Window for Low‐Dose Separation by Implanted Oxygen
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1. Diffusion and aggregation process of oxygen embedded around an amorphous/crystal interface of Si(001) studied by molecular dynamics simulation;Journal of Applied Physics;2017-05-14
2. A novel mechanism of ultrathin SOI synthesis by extremely low-energy hot O+implantation;Journal of Physics D: Applied Physics;2016-07-19
3. Oxygen precipitates distributed around random grain boundaries in a cast-grown multicrystalline silicon crystal;Japanese Journal of Applied Physics;2016-03-15
4. Effects of annealing temperature on buried oxide precipitates in He and O co-implanted Si;Vacuum;2013-07
5. The use of nanocavities for the fabrication of ultrathin buried oxide layers;Applied Physics Letters;2009-01-05
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