Current transport characteristics across shallow hybrid-orientation silicon bonded interfaces
Author:
Publisher
AIP Publishing
Subject
Physics and Astronomy (miscellaneous)
Link
http://aip.scitation.org/doi/pdf/10.1063/1.2712802
Reference17 articles.
1. Low‐resistance Ohmic conduction across compound semiconductor wafer‐bonded interfaces
2. Investigation on direct bonding of III–V semiconductor wafers with lattice mismatch and orientation mismatch
3. Effects of Crystallographic Orientation on Mobility, Surface State Density, and Noise inp-Type Inversion Layers on Oxidized Silicon Surfaces
4. Hybrid-orientation technology (HOT): opportunities and challenges
5. Lattice engineered compliant substrate for defect-free heteroepitaxial growth
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