Adhesion Performance and Microscope Morphology of UV-Curable Semi-interpenetrated Dicing Acrylic PSAs in Si-Wafer Manufacture Process for MCP-Reference-Cited by-同舟云学术

Adhesion Performance and Microscope Morphology of UV-Curable Semi-interpenetrated Dicing Acrylic PSAs in Si-Wafer Manufacture Process for MCP

Published:2012-01-01 Issue:1-3 Volume:26 Page:317-329
ISSN:0169-4243
Container-title:Journal of Adhesion Science and Technology
language:en
Short-container-title:Journal of Adhesion Science and Technology

Author:

Lee Seung-Woo¹,Park Ji-Won²,Kim Hyun-Joong³,Kim Kyoung-Mahn⁴,Kim Hyung-Il⁵,Ryu Jong-Min⁶

Affiliation:

1. a Laboratory of Adhesion & Bio-Composites, Program in Environmental Materials Science, Research Institute for Agriculture & Life Science, Seoul National University, Seoul 151-921, Korea

2. b Laboratory of Adhesion & Bio-Composites, Program in Environmental Materials Science, Research Institute for Agriculture & Life Science, Seoul National University, Seoul 151-921, Korea

3. c Laboratory of Adhesion & Bio-Composites, Program in Environmental Materials Science, Research Institute for Agriculture & Life Science, Seoul National University, Seoul 151-921, Korea;, Email: hjokim@snu.ac.kr

4. d Energy Materials Research Center, Korea Research Institute of Chemical Technology, Daejeon 305-600, Korea

5. e College of Engineering, Chungnam National University, Daejeon 305-764, Korea

6. f College of Engineering, Chungnam National University, Daejeon 305-764, Korea

Publisher

Informa UK Limited

Subject

Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Mechanics of Materials,General Chemistry

Link

https://www.tandfonline.com/doi/pdf/10.1163/016942411X576518

Reference37 articles.

1. Dufour , P. 1993. Radiation Curing in Polymer Science and Technology, Vol. 1. Fundamentals and Methods , Edited by: Fouassier , J. P. and Rabek , J. F. 1–47. London: Elsevier Science Publishers.

2. The curing performance of UV-curable semi-interpenetrating polymer network structured acrylic pressure-sensitive adhesives

3. UV curable pressure-sensitive adhesives for fabricating semiconductors. I. Development of easily peelable dicing tapes

4. Electron beam curing of aliphatic unsaturated polyesters. I. Mechanistic study on converting to pressure-sensitive adhesives

5. Ebe , K. Narita , H. Taguchi , K. and Saito , T. 1998. Proceedings of the Conference on Radiation Curing Asia’88 250Tokyo

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