Subject
Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Mechanics of Materials,General Chemistry
Cited by
11 articles.
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1. Study on the Hygrothermal Reliability of Underfill/Passivation Layer Interface Using the Silane Coupling Agent as Adhesion Promoter;2022 23rd International Conference on Electronic Packaging Technology (ICEPT);2022-08-10
2. USE IN INDUSTRIAL PRODUCTS;Handbook of Antiblocking, Release, and Slip Additives;2021
3. USE IN INDUSTRIAL PRODUCTS;Handbook of Antiblocking, Release, and Slip Additives;2014
4. Flip Chip Underfill: Materials, Process, and Reliability;Advanced Flip Chip Packaging;2013
5. Thermally degradable thermosetting materials;European Polymer Journal;2011-04