Interfacial microstructure evolution and thermal reliability of copper/nickel joints formed by ultrasonic bonding-Reference-Cited by-同舟云学术

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Interfacial microstructure evolution and thermal reliability of copper/nickel joints formed by ultrasonic bonding

Published:2013 Issue:4 Volume:31 Page:192s-196s
ISSN:0288-4771
Container-title:QUARTERLY JOURNAL OF THE JAPAN WELDING SOCIETY
language:en
Short-container-title:QUARTERLY JOURNAL OF THE JAPAN WELDING SOCIETY

Author:

Tanaka Yo,Fujiwara Shinichi,Ogura Tomo,Sano Tomokazu,Hirose Akio

Publisher

Japan Welding Society

Subject

Metals and Alloys,Surfaces, Coatings and Films,Mechanical Engineering,Mechanics of Materials

Reference17 articles.

1. 1) S. Iwata et al., J. Japan Inst. Metals, 45- 6 (1981) 603-609.

2. 2) M. Maeda et al., Microelectronics Reliability, 51 (2011) 130-136.

3. 3) S. Fujiwara et al., MATE, 10 (2004) 277-282.

4. 4) T. Tomioka et al., MATE, 6 (2000) 163-168.

5. 5) A. Shah et al., Journal of Applied Physics, 106 (2009) 013503.

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Environmental Reliability Evaluation of the Ultrasonic Bonded Metal with High- Temperature Test;2022 International Conference on Electronics Packaging (ICEP);2022-05-11

2. Thermal Fatigue Properties of Ultrasonically Bonded Copper Joints;Applied Sciences;2019-04-15

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