Micro Joining Package(Technical Topics)-Low Temperature Sintering Bonding Using Ag Nanoparticles and Ag2O Particles-
Author:
Publisher
Japan Welding Society
Subject
Metals and Alloys,Surfaces, Coatings and Films,Mechanical Engineering,Mechanics of Materials
Reference33 articles.
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3. 3) J. R. Groza and R. J. Dowding: "Nanoparticulate Materials Densification", NanoStructured Materials, Vol. 7 (1996), 749-768.
4. 4) Y. Akada, H. Tatsumi, T. Yamaguchi, A. Hirose, T. Morita and E. Ide: "Interfacial Bonding Mechanism Using Silver Metallo-Organic Nanoparticles to Bulk Metals and Observation of Sintering Behavior", Mater. Trans., 49 (2008), 1537-1545.
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