Optimization And Analysis of Furnace Temperature Profile for The Processing Technology of Electronic Components

Abstract

The soldering furnace is an important piece of equipment for processing and soldering electronic components in the integrated circuit design process. After the printed circuit boards are mounted with various electronic components, they are placed in the soldering furnace for heating so that the electronic components are automatically soldered to the circuit boards. In this process, the furnace temperature profile, which records temperature data of the electronic components, is an important reference indicator for measuring the effectiveness of electronic component processing. In the context of electronic component soldering, the transfer speed of the furnace and the setting of the temperature in each temperature zone are decisive in ensuring the quality of the component soldering. Based on the Newton's law of cooling and heat equation, this paper establishes several mathematical models to study the effect of the temperature setting of each temperature zone and the transfer speed of the soldering furnace on the furnace temperature profile with the help of multi-objective planning, circular search algorithm and other mathematical methods. Finally, the corresponding conclusions and optimization methods of furnace temperature profile are drawn, which have certain significance for the processing of electronic components.