Author:
Xiang Jianhua,Deng Liangming,Zhou Chao,Zhao Hongliang,Huang Jiale,Tao Sulian
Abstract
AbstractWith the advent of the 5G era, the design of electronic equipment is developing towards thinness, intelligence and multi-function, which requires higher cooling performance of the equipment. Micro-channel heat sink is promising for the heat dissipation of super-thin electronic equipment. In this study, thermal resistance theoretical model of the micro-channel heat sink was first established. Then, fabrication process of the micro-channel heat sink was introduced. Subsequently, heat transfer performance of the fabricated micro-channel heat sink was tested through the developed testing platform. Results show that the developed micro-channel heat sink has more superior heat dissipation performance over conventional metal solid heat sink and it is well suited for high power LEDs application. Moreover, the micro-channel structures in the heat sink were optimized by orthogonal test. Based on the orthogonal optimization, heat dissipation performance of the micro-channel radiator was further improved.
Funder
National Natural Science Foundation of China
Guangzhou Science and Technology Project
Special Innovation Projects of Universities in Guangdong Province
Publisher
Springer Science and Business Media LLC
Subject
Industrial and Manufacturing Engineering,Mechanical Engineering
Cited by
55 articles.
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