Etching characteristics of Si{110} in 20 wt% KOH with addition of hydroxylamine for the fabrication of bulk micromachined MEMS-Reference-Cited by-同舟云学术

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Etching characteristics of Si{110} in 20 wt% KOH with addition of hydroxylamine for the fabrication of bulk micromachined MEMS

Published:2017-05-26 Issue:1 Volume:5 Page:
ISSN:2213-9621
Container-title:Micro and Nano Systems Letters
language:en
Short-container-title:Micro and Nano Syst Lett

Author:

Rao A. V. Narasimha,Swarnalatha V.,Pal P.^ORCID

Funder

Department of Science and Technology Delhi India

Council of Scientific and Industrial Research

Publisher

Springer Science and Business Media LLC

Subject

Biomedical Engineering,Biomaterials

Link

http://link.springer.com/content/pdf/10.1186/s40486-017-0057-7.pdf

Reference52 articles.

1. Zubel I, Kramkowska M (2005) Possibilities of extension of 3D shapes by bulk micromachining of different Si (hkl) substrates. J Micromech Microeng 15(3):485–493

2. Yang EH, Yang SS, Han SW, Kim SY (2005) Fabrication and dynamic testing of electrostatic actuators with p+ silicon diaphragms. Sens Actuators A phys 50:151–156

3. Pal P, Sato K (2009) Complex three dimensional structures in Si{100} using wet bulk micromachining. J Micromech Microeng 19(10):105008

4. Xu YW, Michael A, Kwok CY (2011) Formation of ultra-smooth 45 micromirror on (100) silicon with low concentration TMAH and surfactant: techniques for enlarging the truly 45 portion. Sens Actuators A Phys 166(1):164–171

5. Lee S, Park S, Cho D (1999) The surface/bulk micromachining (SBM) process: a new method for fabricating released microelectromechanical systems in single crystal silicon. J Microelectromech Syst 8:409–416

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