Microstructure refinement mechanism of undercooled Cu55Ni45 alloys-Reference-Cited by-同舟云学术

Microstructure refinement mechanism of undercooled Cu55Ni45 alloys

Published:2021-09-01 Issue:3 Volume:39 Page:319-330
ISSN:2083-134X
Container-title:Materials Science-Poland
language:en
Short-container-title:

Author:

Wang Hongfu¹,Tang Cheng¹,An Hongen²,Zhao Yuhong³

Affiliation:

1. School of Mechanical Engineering , North University of China , Taiyuan , Shanxi , China

2. Faculty of Engineering , University Malaysia Sabah , Kota Kinabalu , Malaysia

3. College of Materials Science and Engineering , North University of China , Taiyuan , Shanxi , China

Abstract

Abstract Different undercooling degrees of Cu55Ni45 alloy were obtained by the combination of molten glass purification and cyclic superheating, and the maximum undercooling degree reached 284 K. The microstructure of the alloy was observed by metallographic microscope, and the evolution of microstructure was studied systematically. There are two occasions of grain refinement in the solidification structure of the alloy: one occurs in the case of low undercooling, and the other occurs in the case of high undercooling. Electron backscatter diffraction (EBSD) technology was used to analyze the rapid solidification structure under high undercooling. The features of flat polygonal grain boundary, high proportion of twin boundary, and large proportion of large angle grain boundary indicate recrystallization. The change in microhardness of the alloy under different undercooling degrees was studied by microhardness tester. It was found that the average microhardness decreased sharply at high undercooling degrees, which further confirmed the recrystallization of the solidified structure at high undercooling degrees.

Publisher

Walter de Gruyter GmbH

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Link

https://www.sciendo.com/pdf/10.2478/msp-2021-0027

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