1. Pressure Sensors packaged in Plastic;Frank;Electronic Packaging and Production,1986
2. Bonding Techniques for Microsensors;Ko,1985
3. Packaging and Interconnection of Sensors;Reichl;Sensors and Actuators A,1991
4. Microsensor Packaging and System Partitioning;Senturia;Sensors and Actuators A,1988
5. Fusing silicon wafers with low temperature melting temperature glass;Field;Sensors and Actuators A,1990