Electromigration in flip-chip solder joints-Reference-Cited by-同舟云学术

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Electromigration in flip-chip solder joints

Published:2011 Issue: Volume: Page:285-329
ISSN:
Container-title:Electromigration in Thin Films and Electronic Devices
language:
Short-container-title:

Author:

Yang D.,Chan Y.C.,Pecht M.

Publisher

Elsevier

Link

http://woodhead.metapress.com/index/J6411615W8625780.pdf

Reference93 articles.

1. International technology roadmap for semiconductors;ITRs,2003

2. Solder joint technology: materials, properties, and reliability;Tu,2007

3. International technology roadmap for semiconductors;Assembly and packaging section,2007

4. Electromigration issues in lead-free solder joints;Chen;J Mater Sci: Mater Electron,2007

5. Current-induced marker motion in gold wires;Huntington;J Phys Chem Solids,1961

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