The Influence of Silver Powder Filler on the Curing Process and Structure of Conducting Adhesives

Author:

Gulyaev A. I.,Besednov K. L.,Petrova A. P.,Antyufeeva N. V.

Publisher

Pleiades Publishing Ltd

Subject

Polymers and Plastics,General Chemical Engineering,General Chemistry

Reference24 articles.

1. E. N. Kablov, “Innovative developments of the Russian State Research Center VIAM for the implementation of the Strategic Directions for the Development of Materials and Technologies for Their Processing to 2030,” Aviats. Mater. Tekhnolog., No. 1, 3–33 (2015).

2. P. V. Shershak, N. O. Yakovlev, G. I. Shokin, K. E. Kutsevich, and E. A. Popkova, “An estimation method and the factors affecting quality of gluing of the skin with a cellular filler in the structures of aircraft floor and cabin,” Aviats. Mater. Tekhnolog., No. 2, 74–80 (2020).

3. A. P. Petrova, N. F. Lukina, and A. Yu. Isaev, “Workability of glued junction on the basis of epoxy film glues under the concurrent effect of loads and climatic factors,” Trudy VIAM: Elektron. Nauch.-Tekhn. Zh., No. 9, 6 (2019).

4. A. A. Barannikov, V. I. Postnov, E. A. Veshkin, and I. V. Starostina, “Relationship between energy characteristics of the surface of fiber glass grade VPS-53K with the strength of the glued junction on its basis,” Trudy VIAM: Elektron. Nauch.-Tekhn. Zh., No. 10, 5 (2020).

5. E. N. Kablov, L. V. Chursova, N. F. Lukina, K. E. Ku-tsevich, E. V. Rubtsova, and A. P. Petrova, “A study of epoxide–polysulfone polymer systems for high-strength adhesives of aviation purpose,” Polym. Sci., Ser. D 10, 225–229 (2017).

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