Author:
Zorina M. V.,Kraev S. A.,Lopatin A. Ya.,Mikhailenko M. S.,Okhapkin A. I.,Perekalov A. A.,Pestov A. E.,Chernyshev A. K.,Chkhalo N. I.,Kuznetsov I. I.
Reference20 articles.
1. M. Halbwax, T. Sarnet, P. Delaporte, M. Sentis, H. Etienne, F. Torregrosa, V. Vervisch, I. Perichaud, and S. Martinuzzi, Thin Solid Films 516, 6791 (2008). https://www.doi.org/10.1016/j.tsf.2007.12.117
2. J. Oh, H.-C. Yuan, and H. M. Branz, Nat. Nanotechnol. 7, 743 (2012).
https://www.doi.org/10.1038/nnano.2012.166
3. P. Repo, J. Benick, V. Vahanissi, J. Schon, G. von Gastrow, B. Steinhauser, M. C. Schubert, M. Hermle, and H. Savin, Energy Procedia 38, 866 (2013). https://www.doi.org/10.1016/j.egypro.2013.07.358
4. S. Wang, G. Scardera, F. J. Ma, Y. Zhang, D. Payne, M. Abbott, and B. Hoex, IEEE J. Photovoltaics 12, 744 (2022).
https://www.doi.org/10.1109/JPHOTOV.2022.3148713
5. S. Sarkar, A. A. Elsayed, E. Nefzaoui, J. Drevillon, P. Basset, F. Marty, M. Anwar, Y. Yu, J. Zhao, X. Yuan, Zh. Liang, D. Khalil, Y. M. Sabry, and T. Bourouina, in Proc. IEEE 32nd International Conference on Micro Electro Mechanical Systems (Seoul, 2019), p. 860. https://www.doi.org/10.1109/MEMSYS.2019.8870641