Comprehensive Performance Analysis of Interconnect Variation by Double and Triple Patterning Lithography Processes
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Published:2014-12-30
Issue:6
Volume:14
Page:824-831
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ISSN:1598-1657
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Container-title:JSTS:Journal of Semiconductor Technology and Science
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language:en
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Short-container-title:JSTS:Journal of Semiconductor Technology and Science
Author:
Kim Youngmin,Lee Jaemin,Ryu Myunghwan
Publisher
The Institute of Electronics Engineers of Korea
Subject
Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials