Accommodation and diffusion of Cu deposited on flat and stepped Cu(111) surfaces
Author:
Publisher
American Physical Society (APS)
Link
http://harvest.aps.org/v2/journals/articles/10.1103/PhysRevB.48.5607/fulltext
Reference11 articles.
1. Reflection High-Energy Electron Diffraction (RHEED) Oscillations at 77 K
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