Electrostatic Theory of Metal Whiskers
Author:
Funder
National Science Foundation
Publisher
American Physical Society (APS)
Subject
General Physics and Astronomy
Link
http://harvest.aps.org/v2/journals/articles/10.1103/PhysRevApplied.1.044001/fulltext
Reference51 articles.
1. Statistical analysis of tin whisker growth
2. Recrystallization as a nucleation mechanism for whiskers and hillocks on thermally cycled Sn-alloy solder films
3. Tin whisker growth driven by electrical currents
4. Effect of UBM Thickness on the Mean Time to Failure of Flip-Chip Solder Joints under Electromigration
5. Electrostatic fields and current-flow impact on whisker growth
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