Nanostructured Copper Filaments in Electrochemical Deposition-Reference-Cited by-同舟云学术

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Nanostructured Copper Filaments in Electrochemical Deposition

Published:2001-04-23 Issue:17 Volume:86 Page:3827-3830
ISSN:0031-9007
Container-title:Physical Review Letters
language:en
Short-container-title:Phys. Rev. Lett.

Author:

Wang Mu,Zhong Sheng,Yin Xiao-Bo,Zhu Jian-Ming,Peng Ru-Wen,Wang Yuan,Zhang Ke-Qin,Ming Nai-Ben

Publisher

American Physical Society (APS)

Subject

General Physics and Astronomy

Link

http://harvest.aps.org/v2/journals/articles/10.1103/PhysRevLett.86.3827/fulltext

Reference23 articles.

1. Full copper wiring in a sub-0.25 μm CMOS ULSI technology

2. A high performance 1.8 V, 0.20 μm CMOS technology with copper metallization

3. Creating electrical contacts between metal particles using directed electrochemical growth

4. Mechanism of a morphology transition in ramified electrochemical growth

5. Formation of a mesh-like electrodeposit induced by electroconvection

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