Wall Association and Recirculation in Expanding Thermal Arc Plasmas
Author:
Publisher
American Physical Society (APS)
Subject
General Physics and Astronomy
Link
http://harvest.aps.org/v2/journals/articles/10.1103/PhysRevLett.76.1840/fulltext
Reference19 articles.
1. A model for the discharge kinetics and plasma chemistry during plasma enhanced chemical vapor deposition of amorphous silicon
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