Leveraging the Cu2SnTe3 additive for an improved thermoelectric figure of merit and module efficiency in Bi0.5Sb1.5Te3-based composites-Reference-Cited by-同舟云学术

Leveraging the Cu₂SnTe₃ additive for an improved thermoelectric figure of merit and module efficiency in Bi_0.5Sb_1.5Te₃-based composites

Published:2024 Issue:15 Volume:12 Page:8785-8795
ISSN:2050-7488
Container-title:Journal of Materials Chemistry A
language:en
Short-container-title:J. Mater. Chem. A

Author:

Pan Qiaoyan¹²,Pang Kaikai¹,Zhang Qiang¹²^ORCID,Liu Yan³,Shi Huilie³,Li Jingsong³,Zhou Wenjie¹,Sun Qianqian¹²,Zhang Yuyou¹,Tan Xiaojian¹²^ORCID,Sun Peng¹²^ORCID,Wu Jiehua¹²,Liu Guo-Qiang¹²^ORCID,Jiang Jun¹²

Affiliation:

1. Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo 315201, China

2. University of Chinese Academy of Sciences, Beijing 100049, China

3. Research Institute of Nuclear Power Operation, Wuhan 430223, China

Abstract

The highly active additive Cu2SnTe3 generates multi-scale defects, effectively reducing lattice thermal conductivity. Along with optimized weighted mobility, the higher quality factor yields a competitive ZT value in the (Bi,Sb)2Te3-based composite.

Funder

National Natural Science Foundation of China

International Cooperation Project of Ningbo City

Publisher

Royal Society of Chemistry (RSC)

Link

http://pubs.rsc.org/en/content/articlepdf/2024/TA/D4TA00552J

Reference62 articles.

1. Cooling, Heating, Generating Power, and Recovering Waste Heat with Thermoelectric Systems

2. Flexible thermoelectrics based on ductile semiconductors

3. Advanced Thermoelectric Design: From Materials and Structures to Devices

4. Manipulation of ionized impurity scattering for achieving high thermoelectric performance in n-type Mg3Sb2-based materials

5. Complex thermoelectric materials

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