Electrodeposition of copper composites from deep eutectic solvents based on choline chloride-Reference-Cited by-同舟云学术

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Electrodeposition of copper composites from deep eutectic solvents based on choline chloride

Published:2009 Issue:21 Volume:11 Page:4269
ISSN:1463-9076
Container-title:Physical Chemistry Chemical Physics
language:en
Short-container-title:Phys. Chem. Chem. Phys.

Author:

Abbott Andrew P.,El Ttaib Khalid,Frisch Gero,McKenzie Katy J.,Ryder Karl S.

Publisher

Royal Society of Chemistry (RSC)

Subject

Physical and Theoretical Chemistry,General Physics and Astronomy

Link

http://pubs.rsc.org/en/content/articlepdf/2009/CP/B817881J

Reference36 articles.

1. Microelectrode Evaluation of Transition Metal‐Aluminum Alloy Electrodepositions in Chloroaluminate Ionic Liquids

2. Electrodeposition of Copper and Copper‐Aluminum Alloys from a Room‐Temperature Chloroaluminate Molten Salt

3. Electrochemical Studies of Cu(I) and Cu(II) in an Aluminum Chloride‐N‐(n‐Butyl)Pyridinium Chloride Ionic Liquid

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4. Influence of anodic treatment of a copper-nickel alloy in a eutectic mixture of choline chloride and urea on the surface morphology and electrocatalytic behavior in the hydrogen evolution reaction;Voprosy Khimii i Khimicheskoi Tekhnologii;2024-07

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