New routes to organometallic molecular junctions via a simple thermal processing protocol-Reference-Cited by-同舟云学术

New routes to organometallic molecular junctions via a simple thermal processing protocol

Published:2019 Issue:22 Volume:7 Page:6630-6640
ISSN:2050-7526
Container-title:Journal of Materials Chemistry C
language:en
Short-container-title:J. Mater. Chem. C

Author:

Ezquerra Ruben¹²³⁴,Eaves Samantha G.⁵⁶⁷⁸⁹,Bock Sören⁵⁶⁷⁸,Skelton Brian W.⁵⁶⁷⁸,Pérez-Murano Francesc¹⁰¹¹⁴^ORCID,Cea Pilar¹²³⁴¹²^ORCID,Martín Santiago¹²³⁴¹²^ORCID,Low Paul J.⁵⁶⁷⁸^ORCID

Affiliation:

1. Departamento de Química Física

2. Facultad de Ciencias

3. Universidad de Zaragoza

4. Spain

5. School of Molecular Sciences

6. University of Western Australia

7. Crawley

8. Australia

9. Department of Chemistry

10. Instituto de Microelectrónica de Barcelona (IMB-CNM, CSIC)

11. Bellaterra 08193

12. Instituto de Ciencias de Materiales de Aragón (ICMA)

Abstract

Gold nanoparticle capped organometallic molecular junctions are prepared from a single source precursor by simple self-assembly and mild thermolysis.

Funder

Australian Research Council

Ministerio de Economía y Competitividad

University of Western Australia

Publisher

Royal Society of Chemistry (RSC)

Subject

Materials Chemistry,General Chemistry

Link

http://pubs.rsc.org/en/content/articlepdf/2019/TC/C9TC01305A

Reference90 articles.

1. Molecular-Scale Electronics: From Concept to Function

2. Molecular Electronics: History and Fundamentals

3. Progress with Molecular Electronic Junctions: Meeting Experimental Challenges in Design and Fabrication

4. Molecular Electronic Junctions

5. Chemical principles of single-molecule electronics

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