Microstructure-driven electrical conductivity optimization in additively manufactured microscale copper interconnects-Reference-Cited by-同舟云学术

Microstructure-driven electrical conductivity optimization in additively manufactured microscale copper interconnects

Published:2023 Issue:20 Volume:13 Page:13575-13585
ISSN:2046-2069
Container-title:RSC Advances
language:en
Short-container-title:RSC Adv.

Author:

Menétrey Maxence¹^ORCID,van Nisselroy Cathelijn²,Xu Mengjia²^ORCID,Hengsteler Julian²,Spolenak Ralph¹,Zambelli Tomaso²^ORCID

Affiliation:

1. Laboratory for Nanometallurgy, Department of Materials, ETH Zürich, Vladimir-Prelog-Weg 1-5/10, 8093 Zürich, Switzerland

2. Laboratory of Biosensors and Bioelectronics, Department of Information Technology and Electrical Engineering, ETH Zürich, Gloriastrasse 35, 8092 Zürich, Switzerland

Abstract

Fluid Force Microscopy (FluidFM) and Electrohydrodynamic Redox Printing (EHD-RP) allow for the direct fabrication of conductive copper microwires on heterogeneous substrates specifically designed for electrical characterization.

Funder

Schweizerischer Nationalfonds zur Förderung der Wissenschaftlichen Forschung

Innosuisse – Schweizerische Agentur für Innovationsförderung

Publisher

Royal Society of Chemistry (RSC)

Subject

General Chemical Engineering,General Chemistry

Link

http://pubs.rsc.org/en/content/articlepdf/2023/RA/D3RA00611E

Reference36 articles.

1. Additive Manufacturing of Metal Structures at the Micrometer Scale

2. Functional Materials for Two‐Photon Polymerization in Microfabrication