Silicon direct bonding via low-temperature wet chemical surface activation-Reference-Cited by-同舟云学术

Silicon direct bonding via low-temperature wet chemical surface activation

Published:2016 Issue:43 Volume:6 Page:37079-37084
ISSN:2046-2069
Container-title:RSC Advances
language:en
Short-container-title:RSC Adv.

Author:

Mai Chengle¹²³⁴,Sun Jiayuan¹²³⁴,Chen Hongtao¹²³⁴,Mai Cheng-Kang⁵⁶⁷⁸,Li Mingyu¹²³⁴

Affiliation:

1. State Key Laboratory of Advanced Welding and Joining

2. Harbin Institute of Technology

3. Harbin

4. China

5. Materials Research Laboratory

6. University of California

7. Santa Barbara

8. USA

Abstract

A p–n junction with excellent I–V characteristics was prepared through low-temperature chemical surface activation direct bonding without rigorous conditions.

Publisher

Royal Society of Chemistry (RSC)

Subject

General Chemical Engineering,General Chemistry

Link

http://pubs.rsc.org/en/content/articlepdf/2016/RA/C6RA05189H

Reference25 articles.

1. Wafer bonding for silicon‐on‐insulator technologies

2. Silicon‐to‐silicon direct bonding method

3. Nanoadhesion layer for enhanced Si–Si and Si–SiN wafer bonding

4. Characterization of bonding interface prepared by room-temperature Si wafer direct bonding using the surface smoothing effect of a Ne fast atom beam

5. Investigation of fluorine containing plasma activation for room-temperature bonding of Si-based materials

Cited by 12 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Effects of argon plasma pretreatment of Si wafers on Si-Si bonding based on Mo/Au interlayers;Surface Topography: Metrology and Properties;2023-05-22

2. Argon Ion Beam Current Dependence of Si-Si Surface Activated Bonding;Materials;2022-04-25

3. Shielding effect of hydrophobic graphene on contact time dependence of adhesion force and instability with repeated contacts at silica/silica interface;The Journal of Adhesion;2022-01-10

4. Evolution of Wafer Bonding Technology and Applications from Wafer-Level Packaging to Micro/Nanofluidics-Enhanced Sensing;Advanced MEMS/NEMS Fabrication and Sensors;2021-10-13

5. Dynamic phase control with printing and fluidic materials' interaction by inkjet printing an RF sensor directly on a stereolithographic 3D printed microfluidic structure;Lab on a Chip;2021