Plasma functionalization and etching for enhancing metal adhesion onto polymeric substrates-Reference-Cited by-同舟云学术

Plasma functionalization and etching for enhancing metal adhesion onto polymeric substrates

Published:2015 Issue:77 Volume:5 Page:62348-62357
ISSN:2046-2069
Container-title:RSC Advances
language:en
Short-container-title:RSC Adv.

Author:

Lambaré C.¹²³⁴⁵,Tessier P.-Y.¹²³⁴⁵,Poncin-Epaillard F.⁶⁷⁸⁹¹⁰,Debarnot D.⁶⁷⁸⁹¹⁰

Affiliation:

1. Institut des Matériaux Jean Rouxel

2. IMN

3. Université de Nantes

4. CNRS

5. 44322 Nantes cedex 3

6. LUNAM Université

7. UMR Université du Maine – CNRS n°6283

8. Institut des Molécules et Matériaux du Mans – Département Polymères

9. Colloïdes et Interfaces

10. 72085 Le Mans

Abstract

The metallization of plastics materials, dealing with a lot of industrial applications in the field of automotive, electronic, etc.…, is generally performed by a chemical and/or electrochemical process not so ecofriendly.

Publisher

Royal Society of Chemistry (RSC)

Subject

General Chemical Engineering,General Chemistry

Link

http://pubs.rsc.org/en/content/articlepdf/2015/RA/C5RA08844E

Reference45 articles.

1. Adhesion characteristics of copper thin film deposited on PET substrate by electron cyclotron resonance–metal organic chemical vapor deposition

2. Relation between surface preconditioning and metal deposition in direct galvanic metallization of insulating surfaces

3. A comparison of chemical and atmospheric plasma assisted copper plating on carbon fiber reinforced epoxy polymer surfaces

4. Gold coating of polyethylene modified by argon plasma discharge

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