Capping layer enabled controlled fragmentation of two-dimensional materials by cold drawing

Author:

Chen Ming12ORCID,Li Dong3,Hou Yuxin12,Gu Mengxi12,Zeng Qingsheng4,Ning De12,Li Weimin12ORCID,Zheng Xue12ORCID,Shao Yan12,Wang Zhixun5,Xia Juan6,Yang Chunlei12,Wei Lei5ORCID,Gao Huajian37

Affiliation:

1. Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Shenzhen 518055, China

2. University of Chinese Academy of Sciences, Beijing 100049, China

3. School of Mechanical and Aerospace Engineering, Nanyang Technological University, Singapore 639798, Singapore

4. Center for Programmable Materials, School of Materials Science and Engineering, Nanyang Technological University, Singapore 639798, Singapore

5. School of Electrical and Electronic Engineering, Nanyang Technological University, Singapore 639798, Singapore

6. Institute of Fundamental and Frontier Sciences, University of Electronic Science and Technology of China, Chengdu, China

7. Institute of High Performance Computing, A*STAR, Singapore 138632, Singapore

Abstract

This study gives an accurate understanding of interactions between 2D materials, polymer substrates, and capping layers during cold drawing, and offers guidance for potential applications such as flexible electronics.

Funder

Basic and Applied Basic Research Foundation of Guangdong Province

Shenzhen Fundamental Research Program

Chinese Academy of Sciences

Ministry of Education - Singapore

Agency for Science, Technology and Research

Publisher

Royal Society of Chemistry (RSC)

Subject

Electrical and Electronic Engineering,Process Chemistry and Technology,Mechanics of Materials,General Materials Science

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