1. aDepartment of Electrical and Electronic Engineering, The University of Hong Kong, Pokfulam Road, Hong Kong
2. bACCESS – AI Chip Center for Emerging Smart Systems, InnoHK Centers, Hong Kong Science Park, Hong Kong
3. cKey Laboratory of Microelectronics Devices and Integrated Technology, Institute of Microelectronics, Chinese Academy of Sciences, Beijing, 100029, China
4. dSchool of Microelectronics, Southern University of Science and Technology, Shenzhen, 518055, China