Texture-structure-based liquid metal filling for blind-end microchannels and its application on multi-layer chips-Reference-Cited by-同舟云学术

Texture-structure-based liquid metal filling for blind-end microchannels and its application on multi-layer chips

Published:2023 Issue:35 Volume:13 Page:24228-24236
ISSN:2046-2069
Container-title:RSC Advances
language:en
Short-container-title:RSC Adv.

Author:

Li Yuqing¹²,Zhang Huimin¹³,Li Qian¹³,Deng Yuqin¹²,Ye Zi¹,Gui Lin¹²^ORCID

Affiliation:

1. Key Laboratory of Cryogenics, Technical Institute of Physics and Chemistry, Chinese Academy of Sciences, 29 Zhongguancun East Road, Haidian District, Beijing, 100190, China

2. School of Future Technology, University of Chinese Academy of Sciences, Beijing, 10039, China

3. School of Engineering Science, University of Chinese Academy of Sciences, Beijing, 10039, China

Abstract

Multi-layer liquid metal high-precision filling with only one injection inlet.

Funder

National Key Research and Development Program of China

State Grid Corporation of China

Publisher

Royal Society of Chemistry (RSC)

Subject

General Chemical Engineering,General Chemistry

Link

http://pubs.rsc.org/en/content/articlepdf/2023/RA/D3RA04497A

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