A handy reversible bonding technology and its application on fabrication of an on-chip liquid metal micro-thermocouple-Reference-Cited by-同舟云学术

A handy reversible bonding technology and its application on fabrication of an on-chip liquid metal micro-thermocouple

Published:2021 Issue:23 Volume:21 Page:4566-4573
ISSN:1473-0197
Container-title:Lab on a Chip
language:en
Short-container-title:Lab Chip

Author:

Hong Jie¹²,Gong Jiahao¹²,Li Qian¹²,Deng Zhongshan¹²,Gui Lin¹²^ORCID

Affiliation:

1. Key Laboratory of Cryogenics, Technical Institute of Physics and Chemistry, Chinese Academy of Sciences, 29 Zhongguancun East Road, Haidian District, Beijing 100190, China

2. School of Future Technology, University of Chinese Academy of Sciences, Beijing 100039, China

Abstract

An on-chip liquid metal based micro-thermocouple based on a reversible bonding technology.

Funder

National Key Research and Development Program of China

State Grid Corporation of China

Technical Institute of Physics and Chemistry of the Chinese Academy of Sciences

Publisher

Royal Society of Chemistry (RSC)

Subject

Biomedical Engineering,General Chemistry,Biochemistry,Bioengineering

Link

http://pubs.rsc.org/en/content/articlepdf/2021/LC/D1LC00726B

Reference44 articles.

1. Stretchable and Soft Electronics using Liquid Metals

2. Inherently aligned microfluidic electrodes composed of liquid metal

3. Microfluidic stretchable RF electronics

4. Microfluidic electronics

5. An autonomously electrically self-healing liquid metal–elastomer composite for robust soft-matter robotics and electronics

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