Nickel nanoparticle decorated silicon carbide as a thermal filler in thermal conductive aramid nanofiber-based composite films for heat dissipation applications-Reference-Cited by-同舟云学术

Nickel nanoparticle decorated silicon carbide as a thermal filler in thermal conductive aramid nanofiber-based composite films for heat dissipation applications

Published:2023 Issue:30 Volume:13 Page:20984-20993
ISSN:2046-2069
Container-title:RSC Advances
language:en
Short-container-title:RSC Adv.

Author:

Wang Xin¹²^ORCID,Dong Huarui¹²,Ma Qingyi¹³,Chen Yanjie¹²,Zhao Xueling¹²,Chen Lifei¹²^ORCID

Affiliation:

1. School of Energy and Materials, Shanghai Key Laboratory of Engineering Materials Application and Evaluation, Shanghai Polytechnic University, Shanghai 201209, China

2. Shanghai Thermophysical Properties Big Data Professional Technical Service Platform, Shanghai Engineering Research Center of Advanced Thermal Functional Materials, Shanghai 201209, China

3. School of Resources and Environmental Engineering, Shanghai Polytechnic University, Shanghai 201209, P. R. China

Abstract

A novel Ni nanoparticle-decorated SiC composite was prepared as thermal filler; the synergistic effect improved the thermal conductivity, thermal stability, and puncture resistance of the ANF-based composite films.

Funder

Shanghai Education Development Foundation

Shanghai Polytechnic University

Shanghai Municipal Education Commission

Science and Technology Commission of Shanghai Municipality

Publisher

Royal Society of Chemistry (RSC)

Subject

General Chemical Engineering,General Chemistry

Link

http://pubs.rsc.org/en/content/articlepdf/2023/RA/D3RA03336H

Reference43 articles.