Fabrication of sinter-free conductive Cu paste using sub-10 nm copper nanoparticles
Author:
Affiliation:
1. School of Chemical and Biological Engineering
2. Seoul National University
3. Gwanakgu
4. Korea
Abstract
Fabrication procedure of conductive Cu NP paste using sub-10 nm copper nanoparticles for excellent conductivity without heat treatment.
Funder
Seoul National University
National Research Foundation of Korea
Publisher
Royal Society of Chemistry (RSC)
Subject
Materials Chemistry,General Chemistry
Link
http://pubs.rsc.org/en/content/articlepdf/2017/TC/C7TC02893H
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