Affiliation:
1. College of Materials Science and Engineering, Shenzhen University, Shenzhen 518060, China
2. Shenzhen Institute of Advanced Electronic Materials, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Shenzhen, 518055, China
Abstract
With the rapid development of advanced microelectronic equipment, thermal interface materials with high thermal conductivity and excellent mechanical properties have become an urgent need.
Funder
National Natural Science Foundation of China
Guangdong Province Introduction of Innovative R&D Team
Chinese Academy of Sciences
Shenzhen Science and Technology Innovation Commission
Science and Technology Bureau, Changsha
Guangdong Provincial Key Laboratory of Urology
Publisher
Royal Society of Chemistry (RSC)
Subject
Materials Chemistry,General Chemistry
Cited by
22 articles.
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