Aligned structures of mesogenic motifs in epoxy resin and their thermal conductivities-Reference-Cited by-同舟云学术

Aligned structures of mesogenic motifs in epoxy resin and their thermal conductivities

Published:2022 Issue:8 Volume:4 Page:1970-1978
ISSN:2516-0230
Container-title:Nanoscale Advances
language:en
Short-container-title:Nanoscale Adv.

Author:

Lee Minhwan¹^ORCID,Ha Min Young¹,Lee Mooho²,Kim Ju Hyun²,Kim Sung Dug²,Kim In²,Lee Won Bo¹^ORCID

Affiliation:

1. School of Chemical and Biological Engineering, Seoul National University, Seoul 08826, Republic of Korea

2. Material Research Center, Samsung Advanced Institute of Technology, Samsung Electronics Co., Ltd, Gyeonggi-do 16678, Republic of Korea

Abstract

The structure–property correlation of the epoxy resin between the alignment of the mesogenic groups and the thermal conductivity was studied with the MD simulation.

Funder

National Research Foundation of Korea

Samsung

Ministry of Science and ICT, South Korea

Publisher

Royal Society of Chemistry (RSC)

Subject

General Engineering,General Materials Science,General Chemistry,Atomic and Molecular Physics, and Optics,Bioengineering

Link

http://pubs.rsc.org/en/content/articlepdf/2022/NA/D1NA00896J

Reference45 articles.

1. Synthesis of novel trifunctional epoxy resins and their modification with polydimethylsiloxane for electronic application

2. Modification of epoxy resins with polysiloxane thermoplastic polyurethane for electronic encapsulation: 1

3. Synthesis and application of epoxy resins: A review

4. Carbon nanotube composites for thermal management

5. An infiltration method for preparing single-wall nanotube/epoxy composites with improved thermal conductivity

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Advancements in The Cross-Linking and Morphology of Liquid Crystals;Crystals;2024-05-05

2. Advances in Liquid Crystal Epoxy: Molecular Structures, Thermal Conductivity, and Promising Applications in Thermal Management;ENERGY & ENVIRONMENTAL MATERIALS;2024-02-11

3. Advances in polymers and composite dielectrics for thermal transport and high-temperature applications;Composites Part A: Applied Science and Manufacturing;2023-01