Liquid metal-based electrical interconnects and interfaces with excellent stability and reliability for flexible electronics-Reference-Cited by-同舟云学术

Liquid metal-based electrical interconnects and interfaces with excellent stability and reliability for flexible electronics

Published:2019 Issue:12 Volume:11 Page:5441-5449
ISSN:2040-3364
Container-title:Nanoscale
language:en
Short-container-title:Nanoscale

Author:

Li Menglu¹²³⁴⁵^ORCID,Wu Yongzhi¹²³⁴⁵,Zhang Liang¹²³⁴⁵,Wo Hualei¹²³⁴⁵,Huang Shuyi¹²³⁴⁵,Li Wei¹²³⁴⁵,Zeng Xiangyu¹²³⁴⁵,Ye Qikai¹²³⁴⁵,Xu Tianbai¹²³⁴⁵^ORCID,Luo Jikui¹²³⁴⁵,Dong Shurong¹²³⁴⁵,Li Yubo¹²³⁴⁵,Jin Hao¹²³⁴⁵,Wang Xiaozhi¹²³⁴⁵^ORCID

Affiliation:

1. Key Laboratory of Micro-nano Electronic Devices and Smart Systems of Zhejiang Province

2. College of Information Science & Electronic Engineering

3. Zhejiang University

4. Hangzhou 310027

5. China

Abstract

We report on the detailed investigations on the reliability and stability of the liquid metal-based interconnects/interfaces under various mechanical deformations and compare them with those using silver paste. The results demonstrate that liquid metal interconnects and interfaces show superior performance than those of silver paste ones.

Funder

National Natural Science Foundation of China

China Postdoctoral Science Foundation

Publisher

Royal Society of Chemistry (RSC)

Subject

General Materials Science

Link

http://pubs.rsc.org/en/content/articlepdf/2019/NR/C8NR09503E

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