Dissociative ionization and electron beam induced deposition of tetrakis(dimethylamino)silane, a precursor for silicon nitride deposition

Author:

Shih Po-Yuan12,Tafrishi Reza3ORCID,Cipriani Maicol3ORCID,Hermanns Christian Felix1,Oster Jens1,Gölzhäuser Armin2ORCID,Edinger Klaus1,Ingólfsson Oddur3ORCID

Affiliation:

1. Carl Zeiss SMT GmbH, Industriestraße 1, 64380 Roßdorf, Germany

2. Faculty of Physics, Bielefeld University, 33615 Bielefeld, Germany

3. Science Institute and Department of Chemistry, University of Iceland, Dunhagi 3, 107 Reykjavik, Iceland

Abstract

Information about the interaction of low energy electrons with precursors helps us improve the composition of electron-induced deposits in the semi-conductor industry.

Funder

Icelandic Centre for Research

H2020 Marie Skłodowska-Curie Actions

Publisher

Royal Society of Chemistry (RSC)

Subject

Physical and Theoretical Chemistry,General Physics and Astronomy

Reference61 articles.

1. Advances in deposition processes for passivation films

2. Reactive Plasma Deposited Si‐N Films for MOS‐LSI Passivation

3. H.Sato , A.Izumi , A.Masuda and H.Matsumura , Low-k silicon nitride film for copper interconnects process prepared by catalytic chemical vapor deposition method at low temperature , 2001 , vol. 395

4. Handbook of semiconductor manufacturing technology , ed. Nishi; Y. and Doering; R. T. , CRC Press , 2008 , 2nd edn

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