Measurement of stress factors and residual stress of a film byin situX-ray diffraction during four-point bending

Abstract

A method is proposed for the simultaneous measurement of the stress factors and residual stress state of a film byin-situX-ray diffraction during four-point bending. The externally applied load acts as an additional degree of freedom in the stress–strain relation, which allows the problem to be solved for both residual stress and elastic moduli without assuming any grain interaction model. The procedure was tested on a galvanic nickel deposit and the predictions of existing grain interaction models were compared with the experimental results.