Sealing of pits and fissures with an adhesive resin: its use in caries prevention-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Sealing of pits and fissures with an adhesive resin: its use in caries prevention

Published:1967-07 Issue:1 Volume:75 Page:121-128
ISSN:0002-8177
Container-title:The Journal of the American Dental Association
language:en
Short-container-title:The Journal of the American Dental Association

Author:

Cueto Eriberto I.,Buonocore Michael G.

Publisher

Elsevier BV

Subject

General Dentistry

Reference18 articles.

1. Prophylactic odontotomy: the cutting into the tooth for the prevention of disease;Hyatt;Dent Cosmos,1923

2. Prophylactic odontotomy;Hyatt;Dent Cosmos,1923

3. The eradication of enamel fissures;Bodecker;Dent Items Int,1929

4. Enamel fissure eradication;Bodecker;New York Dent J,1964

5. Dental caries immunization without filling;Bodecker;New York Dent J,1964

Cited by 182 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. An In vitro Assessment of the Shear Bond Strength of Two Different Pit and Fissure Sealants in Primary Teeth;Journal of Pharmacy and Bioallied Sciences;2023-07

2. Influence of radiotherapy on the physical-mechanical properties of different pit and fissure sealants;2023-03-31

3. A literature review on moisture resistant pit and fissure sealants;Journal of Population Therapeutics and Clinical Pharmacology;2023-01-01

4. Evaluation of Microleakage of Self-Adhesive Composite Resin in Pits and Fissures of Extracted Premolar Teeth: An in Vitro Study;Jorjani Biomedicine Journal;2022-05-01

5. Remineralizing Effects of Resin-Based Dental Sealants: A Systematic Review of In Vitro Studies;Polymers;2022-02-17

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号京ICP备18003416号-3