Electroless Copper Deposition Using Fe (II) Complex as a Reducing Agent.-Reference-Cited by-同舟云学术

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Electroless Copper Deposition Using Fe (II) Complex as a Reducing Agent.

Published:2002 Issue:8 Volume:53 Page:559-560
ISSN:0915-1869
Container-title:Journal of the Surface Finishing Society of Japan
language:
Short-container-title:J. Surf. Finish Soc. Jpn.

Author:

SONE Michinari,KOBAYAKAWA Koichi,SAITO Makoto,SATO Yuichi

Publisher

The Surface Finishing Society of Japan

Subject

General Engineering

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Green Electroless Plating;Amorphous and Nano Alloys Electroless Depositions;2016

2. 10.4139/sfj.57.799;Journal of The Surface Finishing Society of Japan;2006

3. Electroless copper plating using FeII as a reducing agent;Electrochimica Acta;2004-01

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