Electrochemical Analysis of Additives in Copper Electroplating Bath Using Diamond Electrode-Reference-Cited by-同舟云学术

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Electrochemical Analysis of Additives in Copper Electroplating Bath Using Diamond Electrode

Published:2010 Issue:8 Volume:61 Page:597-597
ISSN:0915-1869
Container-title:Journal of the Surface Finishing Society of Japan
language:en
Short-container-title:Journal of The Surface Finishing Society of Japan

Author:

NISHITANI Tomoko¹,KAWAGUCHI Akihiro²,HONMA Hideo³

Affiliation:

1. Kanagawa Academy of Science and Technology

2. Kanagawa Industrial Technology Center

3. College of Engineering, Kanto Gakuin University

Publisher

The Surface Finishing Society of Japan

Subject

General Engineering

Link

https://www.jstage.jst.go.jp/article/sfj/61/8/61_8_597/_pdf

Reference10 articles.

1. 3) T. Nishitani, A. Kawaguchi, K. Takami, Y. Kikuchi and I. Sakurada ; Abst. 115th Meet., p.249 (Surf. Finish. Soc. Jpn., 2007) (in Japanese).

2. 4) T. Nishitani, A. Kawaguchi, K. Takami and I. Sakurada ; Abst. 116th Meet., p.177 (Surf. Finish. Soc. Jpn., 2007) (in Japanese).

3. 5) T. Nishitani, A. Kawaguchi and H. Honma ; Abst. 118th Meet., p.184 (Surf. Finish. Soc. Jpn., 2008) (in Japanese).

4. 6) T. Nishitani, A. Kawaguchi and H. Honma ; Abst. 118th Meet., p.191 (Surf. Finish. Soc. Jpn., 2008) (in Japanese).

5. 7) Y. Einaga ; NEW DIAMOND, 24, (2), 3 (2008) (in Japanese).

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. High-Performance Liquid Chromatography Analysis of Copper Electroplating Additives used for Via-Filling;Journal of The Surface Finishing Society of Japan;2011

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