Author:
NORO Michio,FUJIWARA Yutaka
Publisher
The Surface Finishing Society of Japan
Reference12 articles.
1. 1) J. A. Abys and C. A. Dullaghan ; “Modern Electroplating 4th edition” M. Schlesinger and M. Paunovic (ed.), p. 483 (2000, John Wiley and Sons, New York).
2. 2) 榎本英彦, 中村 恒;電子部品のめっき技術, p. 21 (日刊工業新聞社, 2003).
3. Copper substrate dissolution in eutectic Sn-Ag solder and its effect on microstructure
4. 4) T. Nagao, Y. Fujiwara, H. Hoshika and H. Miyake ; J. Japan Inst. Electronics Packaging, 8, 208 (2005).