Can zinc aluminate-titania composite be an alternative for alumina as microelectronic substrate?

Author:

Roshni Satheesh Babu,Sebastian Mailadil Thomas,Surendran Kuzhichalil Peethambharan

Publisher

Springer Science and Business Media LLC

Subject

Multidisciplinary

Reference56 articles.

1. Mukherjee, S. P. & Wang, D. W. Low dielectric constant composite laminates filled with molecularly porous aerogels. European patent 0 512 401 A2 (1992).

2. Neugebauer, C. A. Materials for high-density electronic packaging and interconnections in the higher packaging levels. J. Electron. Mater. 18, 229–239 (1989).

3. Minges, M. L. & Committee, A. S. M. I. H. Electronic Materials Handbook: Packaging. Vol. 1 (ASM International, USA, 1989).

4. Barlow, F. D. & Elshabini, A. Ceramic Interconnect Technology Handbook. (CRC Press, USA, 2007).

5. Rao, T., Rymaszewski, E. J. & Klopfenstein, A. G. Microelectronics Packaging Handbook: Semiconductor Packaging. (Springer Science & Business Media, UK, 1997).

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