Author:
Barakat Nasser A. M.,Mahmoud Mohamed S.,Moustafa Hager M.
Abstract
AbstractThis manuscript investigates the influence of the chemical activation step order and process parameters on the specific capacitance of activated carbon derived from rice husk. The chemical activation was performed either before or after the carbonization step, using phosphoric acid (H3PO4) and potassium hydroxide (KOH) as activating agents. For activation before carbonization, the carbonization process was conducted at various temperatures (600, 750, 850, and 1050 °C). On the other hand, for activation after carbonization, the effect of the volume of the chemical agent solution was studied, with 0, 6, 18, 21, 24, and 30 mL/g of phosphoric acid and 0, 18, 30, 45, 60, and 90 mL/g of 3.0 M KOH solution. The results revealed that in the case of chemical activation before carbonization, the optimum temperature for maximizing specific capacitance was determined to be 900 °C. Conversely, in the case of chemical activation after carbonization, the optimal volumes of the chemical agent solutions were found to be 30 mL/g for phosphoric acid (H3PO4) and 21 mL/g for potassium hydroxide (KOH). Moreover, it was observed that utilizing phosphoric acid treatment before the carbonization step leads to an 21% increase in specific capacitance, attributed to the retention of inorganic compounds, particularly silica (SiO2). Conversely, when rice husks were treated with KOH after the carbonization step, the specific capacitance was found to be doubled compared to treatment with KOH prior to the carbonization step due to embedding of SiO2 and KHCO3 inorganic constituents. This study provides valuable insights into the optimization of the chemical activation step order and process parameters for enhanced specific capacitance in rice husk-derived activated carbon. These findings contribute to the development of high-performance supercapacitors using rice husk as a sustainable and cost-effective precursor material.
Publisher
Springer Science and Business Media LLC
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