A logistic-tent chaotic mapping Levenberg Marquardt algorithm for improving positioning accuracy of grinding robot

Author:

Liu Jian,Deng Yonghong,Liu Yulin,Chen Linlin,Hu Zhenzhen,Wei Peiyang,Li Zhibin

Abstract

AbstractThe precision of workpiece machining is critically influenced by the geometric errors in the kinematics of grind robots, which directly affect their absolute positioning accuracy. To tackle this challenge, this paper introduces a logistic-tent chaotic mapping Levenberg Marquardt algorithm designed to accurately identify and compensate for this geometric error. the approach begins with the construction of a forward kinematic model and an error model specific to the robot. Then the algorithm is adopted to identify and compensate for the geometric error. The method establishes a mapping interval around the initial candidate solutions derived from iterative applications of the Levenberg Marquardt algorithm. Within this interval, the logistic-tent chaotic mapping method generates a diverse set of candidate solutions. These candidates are evaluated based on their fitness values, with the optimal solution selected for subsequent iterations. Empirical compensation experiments have validated the proposed method's precision and effectiveness, demonstrating a 6% increase in compensation accuracy and a 47.68% improvement in efficiency compared to existing state-of-the-art approaches. This process not only minimizes the truncation error inherent in the Levenberg Marquardt algorithm but also significantly enhances solution efficiency. Moreover, simulation experiments on grind processes further validate the method's ability to significantly improve the quality of workpiece machining.

Funder

Collaborative Education Program of Ministry of Education of China

Innovation Fund for Industry-university Research of Chinese Universities

National Natural Science Foundation of China

Sichuan Provincial Youth Science Foundation

the talents start-up project of scientific research in Chengdu University of Information Technology

Publisher

Springer Science and Business Media LLC

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