Enhanced Ti0.84Ta0.16N diffusion barriers, grown by a hybrid sputtering technique with no substrate heating, between Si(001) wafers and Cu overlayers
Author:
Publisher
Springer Science and Business Media LLC
Subject
Multidisciplinary
Link
http://www.nature.com/articles/s41598-018-23782-9.pdf
Reference38 articles.
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3. Zhou, Y. M., He, M. Z. & Xie, Z. Diffusion barrier performance of novel Ti/TaN double layers for Cu metallization. Appl. Surf. Sci. 315, 353–359 (2014).
4. Meng, Y. et al. Ultrathin ZrBxOy films as diffusion barriers in Cu interconnects. Vacuum 119, 1–6 (2015).
5. Springer Handbook of Condensed Matter and Materials Data. https://doi.org/10.1007/3-540-30437-1 (Springer Berlin Heidelberg, 2005).
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