Three-dimensional imaging of integrated circuits with macro- to nanoscale zoom
Author:
Publisher
Springer Science and Business Media LLC
Subject
Electrical and Electronic Engineering,Instrumentation,Electronic, Optical and Magnetic Materials
Link
http://www.nature.com/articles/s41928-019-0309-z.pdf
Reference41 articles.
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2. Shahmoradian, S. et al. Three-dimensional imaging of biological tissue by cryo X-ray ptychography. Sci. Rep. 7, 6291 (2017).
3. Servanton, G. et al. Advanced TEM characterization for the development of 28-14 nm nodes based on fully-depleted silicon-on-insulator technology. J. Phys.Conf. Ser. 471, 01202 (2013).
4. Gignac, L. M. et al. High energy BSE/SE/STEM imaging of 8 um thick semiconductor interconnects. Microsc. Microanal. 20(S3), 8–9 (2014).
5. Holler, M. et al. High-resolution non-destructive three-dimensional imaging of integrated circuits. Nature 543, 402 (2017).
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