Qualification of Underfills, Fluxes and Solder Resist for Flip Chip Applications

Author:

TUOMINEN Aulis1,LEHTINEN Ville1,RISTOLAINEN Eero2

Affiliation:

1. Electronics Laboratory, Nokia Research Center

2. Electronics Department, Tampere University of Technology

Publisher

The Electrochemical Society of Japan

Subject

Electrochemistry

Reference18 articles.

1. 1) ASTM, Designation: D 3164-92 a, Standard Test Method for Strength Properties of Adhesively Bonded Plastic Lap-Shear Sandwich Joints in Shear by Tension Loading.

2. 2) ISO 4587-1979 (E), International Standard, Adhesives-Determination of tensile lap-shear strength of high-strength adhesive bonds.

3. 3) M. R. Witty, R. L. Sellers, J. R. Rosson, G. G. Walker, M. P. Meehan, R. L. Vadas, and D. K. Ward, Flip Chip Assembly on Rigid Organic Laminates: A Production Ready Process for Automotive Electronics, International Conference and Exhibition, Multichip Modules and High Density Packaging, Denver, Colorado April 15-17, (1998).

4. 4) A. Tuominen, V. Lehtinen, K. Kulojarvi, J. Kivilahti, the 35th IMAPS Nordic Annual Conference in Stockholm, Sweden, 21-23 September, (1998), pp. T2-1-T2-6.

5. 5) A. Tuominen, A. Perttula, IEMT/IMC Conference, Omiya, Japan, (1997), pp. 321-325.

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