High-Throughput Survey of Ordering Configurations in MXene Alloys Across Compositions and Temperatures-Reference-Cited by-同舟云学术

High-Throughput Survey of Ordering Configurations in MXene Alloys Across Compositions and Temperatures

Published:2017-03-23 Issue:5 Volume:11 Page:4407-4418
ISSN:1936-0851
Container-title:ACS Nano
language:en
Short-container-title:ACS Nano

Author:

Tan Teck Leong¹^ORCID,Jin Hong Mei¹,Sullivan Michael B.¹,Anasori Babak²,Gogotsi Yury²^ORCID

Affiliation:

1. Institute of High Performance Computing, Agency for Science, Technology and Research, 1 Fusionopolis Way, #16-16 Connexis, Singapore 138632, Singapore

2. A.J. Drexel Nanomaterials Institute, and Department of Materials Science & Engineering, Drexel University, Philadelphia, Pennsylvania 19104, United States

Publisher

American Chemical Society (ACS)

Subject

General Physics and Astronomy,General Engineering,General Materials Science

Link

https://pubs.acs.org/doi/pdf/10.1021/acsnano.6b08227

Reference60 articles.

1. Two-dimensional atomic crystals

2. Atomically ThinMoS2: A New Direct-Gap Semiconductor

3. Emerging Photoluminescence in Monolayer MoS2

4. The chemistry of two-dimensional layered transition metal dichalcogenide nanosheets

5. Graphene-analogous low-dimensional materials

Cited by 158 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Applications of 2D Materials (MXenes) in Sensors: A Minireview;Nanosistemi, Nanomateriali, Nanotehnologii;2024-12

2. The role of MXenes and MXene composites in enhancing dye-sensitized solar cells characteristics;Process Safety and Environmental Protection;2024-11

3. Emerging 2D materials beyond mxenes and TMDs: Transition metal carbo-chalcogenides;Progress in Materials Science;2024-08

4. High performance flexible green triboelectric nanogenerator with polyethylene oxide/mica tribo-positive composite material;Applied Materials Today;2024-08

5. Progress in the preparation of polymer-based MXene-enhanced electromagnetic shielding composites by electrospinning;SCIENTIA SINICA Technologica;2024-08-01