Formulation of Screen-Printable Cu Molecular Ink for Conductive/Flexible/Solderable Cu Traces-Reference-Cited by-同舟云学术

Formulation of Screen-Printable Cu Molecular Ink for Conductive/Flexible/Solderable Cu Traces

Published:2019-09-25 Issue:42 Volume:11 Page:38880-38894
ISSN:1944-8244
Container-title:ACS Applied Materials & Interfaces
language:en
Short-container-title:ACS Appl. Mater. Interfaces

Author:

Deore Bhavana^ORCID,Paquet Chantal,Kell Arnold J.,Lacelle Thomas,Liu Xiangyang,Mozenson Olga,Lopinski Gregory,Brzezina Greg¹,Guo Chang,Lafrenière Sylvie²,Malenfant Patrick R. L.^ORCID

Affiliation:

1. Radio Frequency Qualification Facilities David Florida Laboratory, Canadian Space Agency/Government of Canada, Ottawa, Ontario K2H 8S2, Canada

2. E2IP, 750 Boulevard Marcel-Laurin, Saint-Laurent, Quebec H4M 2M4, Canada

Publisher

American Chemical Society (ACS)

Subject

General Materials Science

Link

https://pubs.acs.org/doi/pdf/10.1021/acsami.9b08854

Reference68 articles.

1. Additive Manufacturing of Hybrid Circuits

2. Inorganic nanomaterials for printed electronics: a review

3. Flexible Electronics: The Next Ubiquitous Platform

4. Fully Printed and Encapsulated SWCNT-Based Thin Film Transistors via a Combination of R2R Gravure and Inkjet Printing

5. Scaling and Optimization of Gravure-Printed Silver Nanoparticle Lines for Printed Electronics

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