Thermal Conductivity, Electrical Resistivity, and Microstructure of Cu/W Multilayered Nanofilms-Reference-Cited by-同舟云学术

Thermal Conductivity, Electrical Resistivity, and Microstructure of Cu/W Multilayered Nanofilms

Published:2020-01-23 Issue:7 Volume:12 Page:8886-8896
ISSN:1944-8244
Container-title:ACS Applied Materials & Interfaces
language:en
Short-container-title:ACS Appl. Mater. Interfaces

Author:

Dong Lan¹,Wei Guo¹,Cheng Tao¹,Tang Jun¹,Ye Xiaobin²,Hong Mengqing¹,Hu Lulu¹,Yin Ran¹,Zhao Shuqin¹,Cai Guangxu¹,Shi Yin¹,Pan Bicai²^ORCID,Jiang Changzhong¹,Ren Feng¹^ORCID

Affiliation:

1. School of Physics and Technology, Center for Ion Beam Application, Hubei Nuclear Solid Physics Key Laboratory, and MOE Key Laboratory of Artificial Micro- and Nano-Structures, Wuhan University, Wuhan 430072, P. R. China

2. Key Laboratory of Strongly-Coupled Quantum Matter Physics, Department of Physics, University of Science and Technology of China, Hefei, Anhui 230026, P. R. China

Funder

Program for New Century Excellent Talents in University

National Natural Science Foundation of China

Natural Science Foundation of Hubei Province, China

National Science Fund for Excellent Young Scholars

Publisher

American Chemical Society (ACS)

Subject

General Materials Science

Link

https://pubs.acs.org/doi/pdf/10.1021/acsami.9b21182

Reference51 articles.